Inline 3D AOI device for substrate assembly
Achieving height measurement through complete 3D inspection of solder joint areas! Solving the challenges of conventional moiré method 3D AOI devices.
The inline 3D AOI device "ART SERIES" for substrate mounting has achieved complete 3D inspection of solder joints. With conventional moiré methods, it is not possible to accurately measure the height of solder fillet areas, making it impossible to conduct the solder wetting inspection recommended by IPC standards. The "ART SERIES" can measure component height based on the phase shift of light, allowing for measurements compliant with IPC standards. 【Features】 ■ Complete 3D image acquisition using a top camera and side camera (patent pending) ■ Equipped with five high-resolution 15M pixel cameras ■ OCR inspection of component markings using AI technology ■ 8-stage color lighting: improved defect detection capability ■ Z-axis assist function (camera unit + 36mm movement) *For more details, please contact us or download the catalog.
- Company：日本ミルテック
- Price：Other
